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Whitepapers

Review our resources on our direct-to-chip liquid cooling technology to better understand how we can solve your data center, HPC, or vehicle electrification cooling challenges.

Embedded Microjets for Thermal Management of High Power-Density Electronic Devices.  IEEE Transactions on Components, Packaging, and Manufacturing Technology. 2018.
Practical Concerns for Adoption of Microjet Cooling. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2018.
Sabey Data Centers - a self-contained, plug-and-play system provides practical and cost-effective liquid cooling for colocation customers with AI and High-Performance Computing (HPC) needs.
Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies.  ASME International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2021.

Latest Insights

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Data Centers

Data centers are facing significant energy challenges. It is estimated that 3% of the planet’s total energy consumption is used by data centers with 30% of that attributed to cooling equipment. Learn how JetCool is transforming cooling in data centers today.

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HPC

Engineers seeking to maximize compute density in high-performance computing applications are faced with thermally-bound constraints: heat causes processor throttling, local hot spots, and limits device lifetime. Read more about JetCool’s HPC solutions.

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Colocations

With investments in AI and HPC, more companies are looking for colocation facilities that can support high-density IT deployments. SmartPlate System is a practical and cost-effective solution that allows customers to deploy higher density servers in air-cooled facilities.

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