Data Center Liquid Cooling Applications
Densify Compute and Drive Performance with Data Center Liquid Cooling
Our microconvective cooling® technology, tailored for the demanding requirements of today’s data centers, HPC, and AI applications, is at the core of our liquid cold plate design. This advanced technology offers precision direct-to-chip liquid cooling, supporting superchips over 3,000 watts TDP. Compared to traditional microchannel cold plates, our technology achieves a 3X lower thermal resistance. Our innovative SmartPlates™ can easily integrate into any standard data center rack, while our standalone SmartPlate™ System is ideal for facilities lacking facility water connections. For cooling demands exceeding 3,000W on a single socket, explore our comprehensive liquid-to-chip data center cooling solutions.
3X
Denser Compute
18%
Energy Savings
2000W+
TDP Support
Meet SmartPlate
The Sustainable Data Center Liquid Cooling Choice
SmartPlate, our innovative liquid cold plate solution for data center cooling, makes a significant impact on sustainability by obviating the requirement for chillers and cooling towers. Leveraging our direct-to-chip cooling technology, data center customers enable zero water consumption, over 50% decrease in cooling power usage, and an 18% decrease in total power consumption, preventing an annual emission of 35 million metric tons of CO2 with widespread adoption. Ask about our rack-level, plug-and-play whole product solutions available with our partners today.
JetCool’s SmartPlate leverages microconvective cooling technology to achieve 20-40% lower thermal resistance compared to state-of-the-art microchannel cold plates. As the demand for high-power AI chips grows, microchannels require increasingly narrow pitches and tighter spacing, necessitating finer filtration levels—from the traditional 50 microns to 25 microns. However, our microconvective liquid cooling, with its innovative jet nozzle design, circumvents these performance challenges and pressure increases, offering a more efficient cooling solution.
SmartPlate Outperforms Microchannel Cold Plates
SmartPlate System
Liquid Cooling with No Plumbing Needed
Experience the performance and sustainability benefits of liquid cooling anywhere & without facility upgrades -no plumbing or facility water is required.
Cools up to 850W in a 1U and 1200W in 2U chassis in hot climates while reducing energy consumption.
Reduce server power consumption by 17% by lowering fan speeds with the boost of liquid cooling, driving quieter and more efficient operation
Achieve Immediate Time-to-Value with SmartPlate System
​Unlock unmatched server performance with SmartPlate System:
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High-Capacity Cooling: Efficiently manage extreme workloads, cooling up to 850W in a 1U and 1,200W in a 2U.
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Environment Tolerance: Achieve optimal performance even in challenging conditions, cooling in environments exceeding 35°C.
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Temperature Management: Experience chipset temperatures that are 30% cooler than traditional air-cooled servers.
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Power Efficiency: Slashing fan power by 50%, save up to 4kW per rack.
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Noise Reduction: Achieve a quieter operational environment with a significant 4X lower noise level.
Make an Impact with a Smarter Data Center
01
Future-Proof Design
Our customers future-proof system design while reliably cooling their next three generations of processors, including those that exceed 1,000W per chip.
02
Minimize Footprint
Increase computational power and performance by packing the same compute into a 30% smaller footprint, saving on construction and infrastructure costs.
03
Lower
PUE
Our ultra-low thermal resistance data center liquid cooling solutions reduce power consumption, lowering power usage effectiveness (PUE) to 1.02.
04
Reduce
TCO
Reduce energy costs by 18% and eliminate water consumption. Eliminate power- and water-intensive infrastructure like chillers and cooling towers, reducing total cost of ownership.